Literature on construction
- PolyMEMS
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- Investigation of capillary adhesion between the microcantilever and the substrate with electronic speckle pattern interferometry, Xide Li et al. (2006)
Title Investigation of capillary adhesion between the microcantilever and the substrate with electronic speckle pattern interferometry Authors Xide Li, Yun Peng Publication Applied Physics Letters Volume 89 Issue 23 Pages 234104-3 Date December 04, 2006 Abstract In this letter, the authors present an experimental study of the capillary adhesion of microcantilevers and substrate using electronic speckle pattern interferometry. The transient deformation of a microcantilever caused by the capillary force was measured and the energy function of the adhesion system was constructed based on the independent parameters of adhesion length and volume fraction of the adhesion medium. Therefore, the capillary force could be theoretically determined by the minimum energy function, and the deformation of the microcantilever at the equilibrium state could be calculated and compared with the experimental result. URL http://link.aip.org/link/?APL/89/234104/1 - A thermomechanical model for adhesion reduction of MEMS cantilevers, J.W. Rogers et al. (2002)
Title A thermomechanical model for adhesion reduction of MEMS cantilevers Authors J.W. Rogers, T.J. Mackin, L.M. Phinney Publication Journal of Microelectromechanical Systems Volume 11 Issue 5 Pages 512-520 Date Oct. 2002 Abstract Presents a thermomechanical model that describes adhesion reduction in MEMS structures using laser heating. A fracture mechanics model is developed where the interface between the stiction-failed microcantilever and the substrate is treated as a crack, and the energy release rate is calculated using elastic theory. In order to include the effect of a temperature difference between the microcantilever and the substrate, an associated thermal strain energy is included in the fracture model. If the free length is longer than the critical buckling length, the beam buckles decreasing the strain energy of the system. For surface-micromachined polycrystalline silicon cantilevers with an initial crack length of 400 /spl mu/m, the model predicts that a temperature difference of 100 K repairs microcantilevers as long as 1300 /spl mu/m. The peeling of adhered beams from the substrate after laser irradiation is experimentally shown with measured crack lengths within 15% of predicted values indicating that the proposed model establishes the mechanism of adhesion reduction by laser irradiation. DOI 10.1109/JMEMS.2002.803412 - Mechanical stability and adhesion of microstructures under capillary forces. I. Basic theory, C.H. Mastrangelo et al. (1993)
Title Mechanical stability and adhesion of microstructures under capillary forces. I. Basic theory Authors C.H. Mastrangelo, C.H. Hsu Publication Journal of Microelectromechanical Systems Volume 2 Issue 1 Pages 33-43 Date 1993 Abstract Strong capillary forces are developed in the fabrication process of surface micromachined structures during the wet etch of sacrificial layers. The magnitude of these forces is in some cases sufficient to deform and pin these structures to the substrate resulting in device failure. The deflection, mechanical stability, and adhesion of thin micromechanical structure under capillary forces are examined. These phenomena are divided into two separate stages of mechanical collapse and adhesion to the underlying substrate. The basic theory of collapse is described. Approximate conditions are computed to prevent contact to the substrate - Elastic energy methods of design analysis, Ralph J. Harker (1986)
Title Elastic energy methods of design analysis Author Ralph J. Harker Date 1986 Place Amsterdam Publisher Elsevier - Formulas for stress and strain, Raymond J Roark (1975)
Title Formulas for stress and strain Author Raymond J Roark Pages 624 Date 1975 Publisher McGraw-Hill URL http://www.amazon.com/Formulas-stress-strain-Raymond-Roark/dp/0070530319/ref=ed_oe_h/102-3944929-9301719 - Electromigration-Induced Failures in, and Microstructure and Resistivity of, Sputtered Gold Films, J. C. Blair et al. (1972)
Title Electromigration-Induced Failures in, and Microstructure and Resistivity of, Sputtered Gold Films Authors J. C. Blair, C. R. Fuller, P. B. Ghate, C. T. Haywood Publication Journal of Applied Physics Volume 43 Issue 2 Pages 307-311 Date February 00, 1972 DOI 10.1063/1.1661112 URL http://link.aip.org/link/?JAP/43/307/1 - Electromigration—A brief survey and some recent results, J.R. Black (1969)
Title Electromigration—A brief survey and some recent results Author J.R. Black Publication Electron Devices, IEEE Transactions on Volume 16 Issue 4 Pages 338-347 Date 1969 Abstract Recently, electromigration has been identified as a potential wear-out failure mode for semiconductor devices employing metal film conductors of inadequate cross-sectional area. A brief survey of electromigration indicates that although the effect has been known for several decades, a great deal of the processes involved is still unknown, especially for complex metals and solute ions. Earlier design equations are improved to account for conductor film cross-sectional area as well as film structure, film temperature, and current density. Design curves are presented which permit the construction of high reliability "infinite life" aluminum conductors for specific conditions of maximum current and temperature stress expected in use. It is also shown that positive gradients, in terms of electron flow, of temperature, current density, or ion diffusion coefficient foreshorten conductor life because they present regions where vacancies condense to form voids. URL http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=1475796